Aaron Chen

Title: Innovations of Inventor Aaron Chen

Introduction

Aaron Chen is a prominent inventor based in Singapore, SG. He has made significant contributions to the field of integrated circuit technology. With a total of 6 patents, his work has had a notable impact on the industry.

Latest Patents

One of his latest patents is an integrated circuit structure that includes an aluminum pad layer on a dielectric stack. This structure features a passivation layer covering the aluminum pad layer and an aluminum shield layer with routing patterns above an embedded memory area. The aluminum shield layer is electrically connected to the uppermost copper layer through a plurality of tungsten vias, which are embedded in the dielectric stack. Another significant patent is for an integrated circuit structure and its fabrication method. This invention includes a substrate with a circuit region and a copper interconnect structure on the substrate. The copper interconnect structure consists of an uppermost copper layer covered by a dielectric layer, with an aluminum pad layer on top. A metal layer is also provided on the circuit region, located between the uppermost copper layer and the aluminum pad layer.

Career Highlights

Aaron Chen has worked with notable companies such as United Microelectronics Corporation and Globalfoundries Singapore Pte. Ltd. His experience in these organizations has contributed to his expertise in integrated circuit design and fabrication.

Collaborations

Some of his coworkers include Chi Ren and Yi Liu, who have collaborated with him on various projects.

Conclusion

Aaron Chen's innovations in integrated circuit technology demonstrate his significant contributions to the field. His patents reflect a deep understanding of complex electronic systems and their fabrication methods.