Jiun Yi Wu

Title: Jiun Yi Wu: Pioneering Innovations in Semiconductor Packaging

Introduction:

In the rapidly evolving landscape of semiconductor technology, Jiun Yi Wu has emerged as a trailblazer with his groundbreaking inventions and a remarkable portfolio of 100 patents. Hailing from Zhongli, Taiwan, Mr. Wu is associated with the renowned Taiwan Semiconductor Manufacturing Company Limited (TSMC), where he has made significant contributions to the field of semiconductor packaging. Let's delve into his latest patents and shed light on the innovative solutions he has brought to the industry.

Latest Patents: Interposer Frame and Semiconductor Packages

Mr. Wu's recent patents showcase his expertise in interposer technology and efficient semiconductor package designs. One of his notable inventions is the "Interposer Frame and Method of Manufacturing the Same." This patent introduces a package that includes a first substrate, a second substrate, and an interposer frame located between them. The interposer frame comprises through substrate holes (TSHs) that align with connection pads on both substrates, enabling the electrical connection between them. This invention significantly enhances the performance and reliability of semiconductor packages.

Furthermore, Mr. Wu has also contributed to the development of the "Semiconductor Packages and Method of Manufacture." This patent revolves around an interposer structure without active devices. The structure encompasses an interconnect device, a dielectric film surrounding it, and a first metallization pattern bonded to the interconnect device. Additionally, the package includes two device dies bonded to opposite sides of the first metallization pattern, allowing seamless electrical connections between them. This innovation greatly simplifies the manufacturing process while maintaining high functionality.

Company and Collaborations:

Jiun Yi Wu is an esteemed member of the Taiwan Semiconductor Manufacturing Company Limited (TSMC). TSMC, renowned for its cutting-edge semiconductor fabrication, has been a pioneer in shaping the future of the industry. As one of the world's largest semiconductor companies, TSMC plays a significant role in pushing the boundaries of technological advancements.

Within the company, Mr. Wu has collaborated with esteemed colleagues Chen-Hua Yu and Chien-Hsun Lee. These collaborations demonstrate the culture of multidisciplinary innovation and teamwork at TSMC, where brilliant minds come together to drive progress and enhance semiconductor technology.

Conclusion:

Jiun Yi Wu's remarkable journey as an inventor and his association with TSMC highlights his invaluable contributions to the field of semiconductor packaging. His innovative patents, including the interposer frame and semiconductor packages, showcase his commitment to pushing the boundaries of possibilities in the industry. As technology continues to advance, we eagerly await further breakthroughs from Mr. Wu and his talented colleagues at TSMC, as they continue to shape the future of semiconductor innovation.