For the Inventor, By the Inventor

Enter assignee name

Bangkok, Thailand

Utac Thai Limited

USPTO Granted Patents = 50

Forward Citations = 162

Loading Chart...

Loading Chart...

24 inventors (with patents filed for the assignee):

Saravuth Sirinorakul (40 out of 76 patents)

Somchai Nondhasitthichai (27 out of 35 patents)

Kasemsan Kongthaworn (4 out of 5 patents)

4. Vorajit Suwannaset (4 out of 4 patents)

5. Woraya Benjavasukul (3 out of 5 patents)

6. Thipyaporn Somrubpornpinan (3 out of 3 patents)

7. Panikan Charapaka (3 out of 3 patents)

8. Apichart Phaowongsa (3 out of 3 patents)

9. Suebphong Yenrudee (2 out of 16 patents)

10. Somchai Nondhasittichai (2 out of 2 patents)

11. Chalermsak Sumithpibul (2 out of 2 patents)

12. Prayoch Tayaphat (2 out of 3 patents)

13. Sorasak Utathin (1 out of 1 patent)

14. Sukunya Kitcharaenthamrong (1 out of 1 patent)

15. Nopnarintr Rabuapin (1 out of 1 patent)

Core Competencies:

Semiconductor Package

Leadframe Substrate

Routing Interconnections

Flip Chip Package

Singulation Process

Ball Grid Array

Heat Transfer

Solderability Preservation

Cooling Nozzle

Bond Wire Stabilization

Land Grid Array

Thin Semiconductor Package

50 patents: Sort by Forward Citations

1. 9922914 - Plated terminals with routing interconnections semiconductor device (2018-03-20),

2. 9922913 - Plated terminals with routing interconnections semiconductor device (2018-03-20),

3. 9899208 - Molded leadframe substrate semiconductor package (2018-02-20),

4. 9818676 - Singulation method for semiconductor package with plating on side of connectors (2017-11-14),

5. 9761435 - Flip chip cavity package (2017-09-12),

6. 9711343 - Molded leadframe substrate semiconductor package (2017-07-18),

7. 9449905 - Plated terminals with routing interconnections semiconductor device (2016-09-20),

8. 9397031 - Post-mold for semiconductor package having exposed traces (2016-07-19),

9. 9355940 - Auxiliary leadframe member for stabilizing the bond wire process (2016-05-31),

10. 9349679 - Singulation method for semiconductor package with plating on side of connectors (2016-05-24),

11. 9196470 - Molded leadframe substrate semiconductor package (2015-11-24),

12. 9099317 - Method for forming lead frame land grid array (2015-08-04),

13. 9099294 - Molded leadframe substrate semiconductor package (2015-08-04),

14. 9093486 - Molded leadframe substrate semiconductor package (2015-07-28),

15. 9082607 - Molded leadframe substrate semiconductor package (2015-07-14),

UTAC THAI LIMITED is a leading semiconductor assembly and test service provider. With state-of-the-art facilities and a highly skilled workforce, the company offers innovative and reliable solutions to customers in the semiconductor industry. UTAC THAI LIMITED focuses on delivering high-quality products and excellent customer service, contributing to the success of its clients worldwide.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Jan 6 2026

50 Patents

#1 in Bangkok

#3 in Thailand

#13,599 in the World

Bangkok, Thailand

Utac Thai Limited

Forward Citations = 162

24 inventors:

Saravuth Sirinorakul (40 out of 76 patents)

Somchai Nondhasitthichai (27 out of 35 patents)

Kasemsan Kongthaworn (4 out of 5 patents)

4. Vorajit Suwannaset (4 out of 4 patents)

5. Woraya Benjavasukul (3 out of 5 patents)

Please report any incorrect information to support@idiyas.com

Loading…