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Bangkok, Thailand

Utac Thai Limited

USPTO Granted Patents = 50

% Expired Patents = 8.0

Forward Citations = 164

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24 inventors (with patents filed for the assignee):

Saravuth Sirinorakul (40 out of 76 patents)

Somchai Nondhasitthichai (27 out of 35 patents)

Kasemsan Kongthaworn (4 out of 5 patents)

4. Vorajit Suwannaset (4 out of 4 patents)

5. Woraya Benjavasukul (3 out of 5 patents)

6. Thipyaporn Somrubpornpinan (3 out of 3 patents)

7. Panikan Charapaka (3 out of 3 patents)

8. Apichart Phaowongsa (3 out of 3 patents)

9. Suebphong Yenrudee (2 out of 16 patents)

10. Somchai Nondhasittichai (2 out of 2 patents)

11. Chalermsak Sumithpibul (2 out of 2 patents)

12. Prayoch Tayaphat (2 out of 3 patents)

13. Sorasak Utathin (1 out of 1 patent)

14. Sukunya Kitcharaenthamrong (1 out of 1 patent)

15. Nopnarintr Rabuapin (1 out of 1 patent)

Core Competencies:

Plated Terminals

Molded Leadframe

Singulation Method

Flip Chip Package

Thermal Management

Land Grid Array

Ball Grid Array

Solderability Preservation

High Speed Singulation

Heat Transfer

Bond Wire Process

Chemical Etchant

50 patents: Sort by Forward Citations

1. 9922914 - Plated terminals with routing interconnections semiconductor device (2018-03-20),

2. 9922913 - Plated terminals with routing interconnections semiconductor device (2018-03-20),

3. 9899208 - Molded leadframe substrate semiconductor package (2018-02-20),

4. 9818676 - Singulation method for semiconductor package with plating on side of connectors (2017-11-14),

5. 9761435 - Flip chip cavity package (2017-09-12),

6. 9711343 - Molded leadframe substrate semiconductor package (2017-07-18),

7. 9449905 - Plated terminals with routing interconnections semiconductor device (2016-09-20),

8. 9397031 - Post-mold for semiconductor package having exposed traces (2016-07-19),

9. 9355940 - Auxiliary leadframe member for stabilizing the bond wire process (2016-05-31),

10. 9349679 - Singulation method for semiconductor package with plating on side of connectors (2016-05-24),

11. 9196470 - Molded leadframe substrate semiconductor package (2015-11-24),

12. 9099317 - Method for forming lead frame land grid array (2015-08-04),

13. 9099294 - Molded leadframe substrate semiconductor package (2015-08-04),

14. 9093486 - Molded leadframe substrate semiconductor package (2015-07-28),

15. 9082607 - Molded leadframe substrate semiconductor package (2015-07-14),

Utac Thai Limited, based in Bangkok, specializes in semiconductor packaging solutions, focusing on advanced technologies that enhance device performance and reliability. The company is known for its expertise in plated terminals, molded leadframes, and various packaging methods including flip chip and land grid array technologies. With a commitment to innovation, Utac Thai Limited also addresses critical aspects of thermal management and solderability preservation, catering to the evolving needs of the semiconductor industry.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

Utac Thai Limited

50 Patents

#1 in Bangkok

#3 in Thailand

#13,996 in the World

Bangkok, Thailand

Utac Thai Limited

Forward Citations = 164

24 inventors:

Saravuth Sirinorakul (40 out of 76 patents)

Somchai Nondhasitthichai (27 out of 35 patents)

Kasemsan Kongthaworn (4 out of 5 patents)

4. Vorajit Suwannaset (4 out of 4 patents)

5. Woraya Benjavasukul (3 out of 5 patents)

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