The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2015

Filed:

Oct. 09, 2009
Applicants:

Somchai Nondhasitthichai, Bangkok, TH;

Saravuth Sirinorakul, Bangkok, TH;

Inventors:

Somchai Nondhasitthichai, Bangkok, TH;

Saravuth Sirinorakul, Bangkok, TH;

Assignee:

UTAC Thai Limited, Bangkok, TH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/00 (2013.01); H01L 2924/1511 (2013.01);
Abstract

A process for forming an optical package comprises at least partially encasing a first leadframe strip in a first mold compound thereby forming a molded leadframe strip, mounting at least one optical semiconductor device on the molded leadframe strip, at least partially encasing the molded leadframe strip, and singulating the molded leadframe strip to form discrete packages for optical applications. An apparatus for forming an optical package comprises means for at least partially encasing a first leadframe strip in a first mold compound thereby forming a molded leadframe strip, means for mounting at least one optical semiconductor device on the at least one molded leadframe strip, means for at least partially encasing the molded leadframe strip, and means for singulating the molded leadframe strip to form discrete and grid array packages.


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