The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Dec. 10, 2012
Applicant:
Utac Thai Limited, Bangkok, TH;
Inventor:
Saravuth Sirinorakul, Bangkok, TH;
Assignee:
UTAC THAI LIMITED, Bangkok, TH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/495 (2013.01); H01L 21/56 (2013.01);
Abstract
A semiconductor package comprises a die attach pad and an auxiliary support member at least partially circumscribing the die attach pad. A set of contact leads is formed extending outward from the die attach pad. A first set of contact pads is formed on the bottom surface of the distal ends of the contact leads. An optional second set of contact pads is formed at the bottom surface of the proximal end. The auxiliary support member prevents damage to the contact leads and prevents the leads from bending during the manufacturing process.