Woraya Benjavasukul

Title: The Innovations of Woraya Benjavasukul

Introduction

Woraya Benjavasukul is a notable inventor based in Bangkok, Thailand. He has made significant contributions to the field of semiconductor technology, holding a total of five patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.

Latest Patents

One of Woraya's latest patents is a semiconductor package with partial plating on contact side surfaces. This invention includes a top surface, a bottom surface that is opposite the top surface, and side surfaces that connect the two. Each side surface features a step, resulting in a bottom surface area that is smaller than that of the top surface. The package contains multiple contacts located at the peripheral edges of the bottom surface. Each contact has a first surface that is flush with the bottom surface, a second surface that is flush with one of the side surfaces, and a curved surface at the corresponding step. In some embodiments, the first and curved surfaces are plated, while the second surface remains exposed.

Career Highlights

Woraya has worked with several prominent companies in the semiconductor industry, including Utac Thai Limited and Utac Headquarters Pte. Ltd. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects in semiconductor packaging.

Collaborations

Woraya has collaborated with talented coworkers such as Thipyaporn Somrubpornpinan and Panikan Charapaka. Their teamwork has fostered an environment of creativity and innovation, leading to advancements in semiconductor technology.

Conclusion

Woraya Benjavasukul is a distinguished inventor whose work in semiconductor packaging has made a significant impact in the industry. His innovative patents and collaborations highlight his dedication to advancing technology.