The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Nov. 29, 2012
Applicant:
Saravuth Sirinorakul, Bangkok, TH;
Inventor:
Saravuth Sirinorakul, Bangkok, TH;
Assignee:
UTAC THAI LIMITED, Bangkok, TH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 23/28 (2013.01);
Abstract
Method of and devices for protecting semiconductor packages are provided. The methods and devices comprise loading a leadframe containing multiple semiconductor packages into a molding device, adding a molding material on a surface of the leadframe, molding the molding material, such that the molding material covers the entire surface of the semiconductor packages except conducting terminals, and singulating the semiconductor packages from the leadframe after molding the molding material.