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Taoyuan, Taiwan

Touch Micro-System Technology Corp.

USPTO Granted Patents = 44

% Expired Patents = 84.1

Forward Citations = 101

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35 inventors (with patents filed for the assignee):

Hung-Yi Lin (11 out of 40 patents)

Chen-Hsiung Yang (9 out of 10 patents)

Yu-Fu Kang (6 out of 9 patents)

4. Kuan-Jui Huang (5 out of 5 patents)

5. Hong-Da Chang (4 out of 4 patents)

6. Hsien-Lung Ho (4 out of 4 patents)

7. Shih-Feng Shao (4 out of 5 patents)

8. Ming-Yen Chiu (3 out of 3 patents)

9. Chin-Chang Pan (3 out of 3 patents)

10. Hung Yi Lin (2 out of 2 patents)

11. Ming Fa Chen (2 out of 2 patents)

12. Yen-Ting Kung (2 out of 2 patents)

13. She-Fen Tien (2 out of 2 patents)

14. Shih-Min Huang (2 out of 3 patents)

15. Chun-Wei Tsai (2 out of 2 patents)

Core Competencies:

LED Packaging

MEMS Devices

Wafer-Level Packaging

Biaxial Scanning Mirror

Planar Coil

Micro Sample Heating

Suspended Structure

Optical Device Caps

Thermal Oxide Layer

Pressure Sensor Calibration

Interposer

Metal Interconnects

44 patents: Sort by Forward Citations

1. 8456724 - Biaxial scanning mirror for image forming apparatus (2013-06-04),

2. 8453318 - Method for making a planar coil (2013-06-04),

3. 8310328 - Planar coil and method of making the same (2012-11-13),

4. 8305671 - Biaxial scanning mirror for image forming apparatus and method for operating the same (2012-11-06),

5. 8172632 - Method of making white LED package structure having a silicon substrate (2012-05-08),

6. 8129206 - Light emitting diode package and method of making the same (2012-03-06),

7. 7987588 - Interposer for connecting plurality of chips and method for manufacturing the same (2011-08-02),

8. 7938977 - Method of modulating resonant frequency of torsional MEMS device (2011-05-10),

9. 7821094 - Light emitting diode structure (2010-10-26),

10. 7795131 - Method of fabricating metal interconnects and inter-metal dielectric layer thereof (2010-09-14),

11. 7741772 - White LED package structure having a silicon substrate and method of making the same (2010-06-22),

12. 7732233 - Method for making light emitting diode chip package (2010-06-08),

13. 7674392 - Method of fabricating a hinge (2010-03-09),

14. 7622334 - Wafer-level packaging cutting method capable of protecting contact pads (2009-11-24),

15. 7598125 - Method for wafer level packaging and fabricating cap structures (2009-10-06),

Company Overview

Touch Micro-System Technology Corp., based in Taoyuan, Taiwan, specializes in advanced micro-electromechanical systems (MEMS) and optical devices. The company focuses on the development and manufacturing of innovative technologies such as biaxial scanning mirrors, planar coils, and capacitive microphones. With expertise in wafer-level packaging and microconnectors, Touch Micro-System is positioned at the forefront of the MEMS industry, delivering high-performance solutions for various applications in electronics and optics.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

44 Patents

#40 in Taoyuan

#443 in Taiwan

#15,756 in the World

Taoyuan, Taiwan

Touch Micro-System Technology Corp.

Forward Citations = 101

35 inventors:

Hung-Yi Lin (11 out of 40 patents)

Chen-Hsiung Yang (9 out of 10 patents)

Yu-Fu Kang (6 out of 9 patents)

4. Kuan-Jui Huang (5 out of 5 patents)

5. Hong-Da Chang (4 out of 4 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Touch Micro-System Technology Corp.. Retrieved from https://idiyas.com/company/touch-micro-system-technology

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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