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Taoyuan, Taiwan

Touch Micro-System Technology Corp.

USPTO Granted Patents = 44

% Expired Patents = 84.1

Forward Citations = 101

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35 inventors (with patents filed for the assignee):

Hung-Yi Lin (11 out of 40 patents)

Chen-Hsiung Yang (9 out of 10 patents)

Yu-Fu Kang (6 out of 9 patents)

4. Kuan-Jui Huang (5 out of 5 patents)

5. Hong-Da Chang (4 out of 4 patents)

6. Hsien-Lung Ho (4 out of 4 patents)

7. Shih-Feng Shao (4 out of 5 patents)

8. Ming-Yen Chiu (3 out of 3 patents)

9. Chin-Chang Pan (3 out of 3 patents)

10. Hung Yi Lin (2 out of 2 patents)

11. Ming Fa Chen (2 out of 2 patents)

12. Yen-Ting Kung (2 out of 2 patents)

13. She-Fen Tien (2 out of 2 patents)

14. Shih-Min Huang (2 out of 3 patents)

15. Chun-Wei Tsai (2 out of 2 patents)

Core Competencies:

Biaxial Scanning Mirror

Planar Coil

Light Emitting Diode

Wafer-Level Packaging

MEMS Devices

Microconnectors

Capacitive Microphone

Optical Device Caps

Suspended Structures

Resonant Frequency Modulation

Thermal Oxide Layer

Pressure Sensor Calibration

44 patents: Sort by Forward Citations

1. 8456724 - Biaxial scanning mirror for image forming apparatus (2013-06-04),

2. 8453318 - Method for making a planar coil (2013-06-04),

3. 8310328 - Planar coil and method of making the same (2012-11-13),

4. 8305671 - Biaxial scanning mirror for image forming apparatus and method for operating the same (2012-11-06),

5. 8172632 - Method of making white LED package structure having a silicon substrate (2012-05-08),

6. 8129206 - Light emitting diode package and method of making the same (2012-03-06),

7. 7987588 - Interposer for connecting plurality of chips and method for manufacturing the same (2011-08-02),

8. 7938977 - Method of modulating resonant frequency of torsional MEMS device (2011-05-10),

9. 7821094 - Light emitting diode structure (2010-10-26),

10. 7795131 - Method of fabricating metal interconnects and inter-metal dielectric layer thereof (2010-09-14),

11. 7741772 - White LED package structure having a silicon substrate and method of making the same (2010-06-22),

12. 7732233 - Method for making light emitting diode chip package (2010-06-08),

13. 7674392 - Method of fabricating a hinge (2010-03-09),

14. 7622334 - Wafer-level packaging cutting method capable of protecting contact pads (2009-11-24),

15. 7598125 - Method for wafer level packaging and fabricating cap structures (2009-10-06),

Touch Micro-System Technology Corp. (TMTC) is a leading provider of innovative touch micro-system solutions. We specialize in the design, development, and manufacturing of cutting-edge touch sensor technologies for diverse applications. Our team of skilled engineers and scientists work relentlessly to create user-friendly and high-performance touch-enabled devices, ranging from smartphones and tablets to advanced industrial touch panels. With a strong emphasis on research and development, TMTC consistently delivers state-of-the-art touch sensing solutions that redefine user experiences across various industries.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 22 2026

Touch Micro-System Technology Corp.

44 Patents

#40 in Taoyuan

#442 in Taiwan

#15,718 in the World

Taoyuan, Taiwan

Touch Micro-System Technology Corp.

Forward Citations = 101

35 inventors:

Hung-Yi Lin (11 out of 40 patents)

Chen-Hsiung Yang (9 out of 10 patents)

Yu-Fu Kang (6 out of 9 patents)

4. Kuan-Jui Huang (5 out of 5 patents)

5. Hong-Da Chang (4 out of 4 patents)

Please report any incorrect information to [email protected]

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