Chun-Wei Tsai

Title: Innovations by Inventor Chun-Wei Tsai

Introduction

Chun-Wei Tsai is a prominent inventor based in Hualien County, Taiwan. He has made significant contributions to the field of micro-system technology, with a total of two patents to his name. His innovative spirit and dedication to advancing technology are reflected in his latest patented inventions.

Latest Patents

Chun-Wei Tsai's recent patents showcase his expertise in wafer-level packaging and optical device fabrication. The first patent is a "Wafer-level packaging cutting method capable of protecting contact pads." This method involves a strategic design where several cavities and precutting lines are formed on the front surface of a cap wafer. By ensuring that the depth of each precutting line is less than the thickness of the cap wafer, this technique facilitates the bonding of the cap wafer to a device wafer containing multiple devices and bonding pads. The subsequent wafer dicing process alongside the precutting lines allows for precise cuts and the effective exposure of bonding pads, culminating in the formation of multiple packaged dies.

The second patented invention is the "Method of fabricating optical device caps." This innovative process involves a wafer with numerous through holes, onto which a glass wafer is placed. A plate featuring concave cavities is aligned with the glass wafer, ensuring that parts of the plate correspond to the through holes of the wafer, providing the necessary space. By utilizing a voltage source with electrical connections to both the wafer and plate, the anodic bonding method is employed to bond the wafer and glass wafer together, creating a series of optical device caps.

Career Highlights

Chun-Wei Tsai is currently associated with Touch Micro-system Technology Corporation, where his work focuses on cutting-edge technologies in micro-systems. His deep understanding of materials and innovative approaches have positioned him as a key player in his field.

Collaborations

Throughout his career, Tsai has had the pleasure of collaborating with fellow inventor Shih-Feng Shao. Their joint efforts have significantly advanced the technology and applications of micro-systems in various domains.

Conclusion

Chun-Wei Tsai continues to push the boundaries of innovation in wafer-level packaging and optical device fabrication. His patents reflect his commitment to enhancing technology and provide a solid foundation for future advancements in micro-system technology. With the support of Touch Micro-system Technology Corporation, Tsai’s contributions are sure to influence the industry significantly.