The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2010
Filed:
Nov. 07, 2006
Hsien-lung Ho, Taipei County, TW;
Hsien-Lung Ho, Taipei County, TW;
Touch Micro-System Technology Inc., Yangmei Township, Taoyuan County, TW;
Abstract
The present invention provides a method of fabricating a hinge. First, a wafer is provided, and a hinge region and at least two through regions are defined on the wafer. The wafer in the hinge region is partially removed from a bottom surface of the wafer. Subsequently, the wafer in the through regions is completely removed from a top surface of the wafer, and the hinge is formed. Thereafter, a wafer level test is performed on the hinge of the wafer. Next, an etching process is performed to adjust the shape of the hinge. According to the method of the present invention, the thickness of the hinge is no longer limited by the thickness of the wafer, and the hinge can accept the wafer level test.