The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2010
Filed:
Mar. 12, 2007
Kuan-jui Huang, Kao-Hsiung Hsien, TW;
Jie-mei Huang, Taipei County, TW;
Chung-hsiang Wang, Taoyuan County, TW;
Kuan-Jui Huang, Kao-Hsiung Hsien, TW;
Jie-Mei Huang, Taipei County, TW;
Chung-Hsiang Wang, Taoyuan County, TW;
Touch Micro-System Technology Inc., Yang-Mei, Taoyuan Hsien, TW;
Abstract
A method of fabricating metal interconnects and an inter-metal dielectric layer thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a substrate by plating processes. Subsequently, an inter-metal dielectric layer is formed on the substrate, the first metal interconnect pattern and the second metal interconnect pattern. The inter-metal dielectric layer is then planarized and the second metal interconnect pattern is exposed.