Jie-Mei Huang

Title: Innovations by Jie-Mei Huang

Introduction

Jie-Mei Huang is a notable inventor based in Taipei County, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the fabrication of metal interconnects.

Latest Patents

Huang holds a patent for a method of fabricating metal interconnects and an inter-metal dielectric layer. This innovative method involves forming a first metal interconnect pattern and a second metal interconnect pattern on a substrate through plating processes. Following this, an inter-metal dielectric layer is created on the substrate, encompassing both metal interconnect patterns. The inter-metal dielectric layer is then planarized, allowing for the exposure of the second metal interconnect pattern.

Career Highlights

Jie-Mei Huang is associated with Touch Micro-system Technology Corp., where he applies his expertise in semiconductor fabrication. His work has been instrumental in advancing the technology used in electronic devices.

Collaborations

Huang has collaborated with notable colleagues, including Kuan-Jui Huang and Chung-Hsiang Wang, contributing to various projects within the field.

Conclusion

Jie-Mei Huang's innovative methods in semiconductor technology highlight his role as a key inventor in the industry. His contributions continue to influence advancements in electronic manufacturing.