Touch Micro-system Technology Corp.

Jie-Mei Huang

Kuan-Jui Huang

Chung-Hsiang Wang

A method of fabricating metal interconnects and an inter-metal dielectric layer thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a substrate by plating processes. Subsequently, an inter-metal dielectric layer is formed on the substrate, the first metal interconnect pattern and the second metal interconnect pattern. The inter-metal dielectric layer is then planarized and the second metal interconnect pattern is exposed.

Growing community of inventors

Taipei County, Taiwan

Jie-Mei Huang