The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Nov. 19, 2008
Kuan-jui Huang, Kao-Hsiung Hsien, TW;
Chang-ping Wang, Taipei, TW;
Hsiu-ming LI, Taipei County, TW;
Shih-min Huang, Taipei, TW;
Hui-chen Kuo, Taoyuan County, TW;
Chia-chun Chen, Kaohsiung County, TW;
Kuan-Jui Huang, Kao-Hsiung Hsien, TW;
Chang-Ping Wang, Taipei, TW;
Hsiu-Ming Li, Taipei County, TW;
Shih-Min Huang, Taipei, TW;
Hui-Chen Kuo, Taoyuan County, TW;
Chia-Chun Chen, Kaohsiung County, TW;
Touch Micro-System Technology Inc., Taoyuan Hsien, TW;
Abstract
The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.