Company Filing History:
Years Active: 2011
Title: Hui-Chen Kuo: Innovator in Chip Connectivity
Introduction
Hui-Chen Kuo is a notable inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of chip connectivity. His innovative approach has led to the development of a unique interposer that enhances the functionality of multiple chips.
Latest Patents
Hui-Chen Kuo holds a patent for an invention titled "Interposer for connecting plurality of chips and method for manufacturing the same." This invention discloses an interposer designed for connecting a plurality of chips. The interposer consists of a connective substrate and at least one through via disposed within the substrate. The connective substrate features a first surface and a second surface. The through via serves as a connector, electrically linking the first and second surfaces. This design allows for the first chip and the second chip to be electrically connected through the through via, enhancing the overall efficiency of chip communication.
Career Highlights
Hui-Chen Kuo is currently employed at Touch Micro-system Technology Corp., where he continues to innovate in the semiconductor industry. His work focuses on improving chip connectivity solutions, which are crucial for modern electronic devices. His dedication to research and development has positioned him as a key player in his field.
Collaborations
Hui-Chen Kuo collaborates with talented individuals such as Kuan-Jui Huang and Chang-Ping Wang. Together, they work on advancing technologies that push the boundaries of semiconductor applications.
Conclusion
Hui-Chen Kuo's contributions to the field of chip connectivity through his innovative patent demonstrate his commitment to advancing technology. His work at Touch Micro-system Technology Corp. and collaborations with fellow inventors highlight his role in shaping the future of semiconductor technology.