Hsiu-Ming Li

Title: Hsiu-Ming Li: Innovator in Chip Connectivity

Introduction

Hsiu-Ming Li is a notable inventor based in Taipei County, Taiwan. He has made significant contributions to the field of chip connectivity through his innovative designs and patents. His work focuses on enhancing the efficiency and functionality of electronic components.

Latest Patents

Hsiu-Ming Li holds a patent for an invention titled "Interposer for connecting plurality of chips and method for manufacturing the same." This invention discloses an interposer used for connecting multiple chips. The interposer includes a connective substrate and at least one through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector and is electrically connected to both the first and second surfaces. The first surface and the second surface are electrically connected to at least a first chip and a second chip, respectively. Additionally, the first chip and the second chip are electrically connected by the through via. Hsiu-Ming Li has 1 patent to his name.

Career Highlights

Hsiu-Ming Li is currently employed at Touch Micro-System Technology Corp., where he continues to develop innovative solutions in the field of micro-systems. His work has been instrumental in advancing technology related to chip interconnectivity.

Collaborations

Hsiu-Ming Li has collaborated with notable colleagues, including Kuan-Jui Huang and Chang-Ping Wang. These collaborations have contributed to the development of cutting-edge technologies in their field.

Conclusion

Hsiu-Ming Li is a prominent inventor whose work in chip connectivity has paved the way for advancements in electronic systems. His innovative patent reflects his commitment to enhancing technology in the micro-system industry.