Touch Micro-system Technology Corp.

Hsiu-Ming Li

Kuan-Jui Huang

Shih-Min Huang

Chang-Ping Wang

Hui-Chen Kuo

Chia-Chun Chen

The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.

Growing community of inventors

Taipei County, Taiwan

Hsiu-Ming Li