Shih-Feng Shao

Title: **Innovative Contributions of Inventor Shih-Feng Shao**

Introduction

Shih-Feng Shao is an accomplished inventor based in Taipei Hsien, Taiwan, known for his significant contributions to the field of wafer-level packaging. With a remarkable portfolio of five patents, Shao has demonstrated a commitment to advancing technology through innovation and engineering excellence.

Latest Patents

Shih-Feng Shao's most recent inventions showcase his expertise in wafer-level packaging methods. One of his latest patents is a "Wafer-level packaging cutting method capable of protecting contact pads." This cutting method involves the formation of several cavities and precutting lines on the front surface of a cap wafer, ensuring the protection of contact pads during the dicing process. By bonding the cap wafer to a device wafer featuring multiple devices and bonding pads, Shao’s method allows for efficient and precise packaging.

Another noteworthy patent is the "Method for wafer level packaging and fabricating cap structures," where a cap wafer is etched to create a plurality of openings, which are then bonded to a transparent wafer. This innovative approach enables the formation of hermetic windows over devices and pads on the device wafer, enhancing the reliability and performance of electronic components.

Career Highlights

Throughout his career, Shih-Feng Shao has worked with reputable companies such as Touch Micro-system Technology Corporation and Touch Micro-systems Technology Inc. His experience in these organizations has allowed him to refine his skills and contribute to significant advancements in the field of micro-systems technology.

Collaborations

Shao has collaborated with notable individuals in his field, including Chen-Hsiung Yang and Hsin-Ya Peng. Working alongside these talented professionals, he has been able to drive innovation and achieve groundbreaking results in the development of wafer-level packaging solutions.

Conclusion

In conclusion, Shih-Feng Shao's innovative approaches and patents in wafer-level packaging reflect his dedication to advancing technology in the semiconductor industry. His contributions continue to influence the landscape of electronic component packaging, solidifying his status as a leading figure in the field of innovations and inventions.