The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2006
Filed:
Nov. 19, 2004
Applicants:
Shih-feng Shao, Taipei Hsien, TW;
Chen-hsiung Yang, Taipei Hsien, TW;
Hsin-ya Peng, Taipei Hsien, TW;
Inventors:
Shih-Feng Shao, Taipei Hsien, TW;
Chen-Hsiung Yang, Taipei Hsien, TW;
Hsin-Ya Peng, Taipei Hsien, TW;
Assignee:
Touch Micro-System Technology Inc., Taoyuan, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of forming a wafer backside interconnecting wire includes forming a mask layer on the back surface, the mask layer including at least an opening corresponding to the bonding pad, performing a first etching process from the back surface to remove the wafer unprotected by the mask layer to form a recess, removing the mask layer, and forming an interconnecting wire on the back surface.