Hsin-Ya Peng

Title: Hsin-Ya Peng: Innovator in Wafer Bonding Technologies

Introduction

Hsin-Ya Peng is a notable inventor based in Taipei Hsien, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in wafer bonding methods. With a total of 2 patents, his work has advanced the efficiency and effectiveness of wafer processing.

Latest Patents

Hsin-Ya Peng's latest patents include innovative methods that enhance wafer bonding techniques. The first patent, titled "Method for Bonding Wafers," describes a process where a photosensitive masking-and-bonding pattern is formed on the surface of a first wafer. An etching process is then performed using this pattern as a hard mask to create a wafer pattern. Finally, the first wafer is bonded to a second wafer using the photosensitive masking-and-bonding pattern. The second patent, "Method of Forming a Wafer Backside Interconnecting Wire," outlines a method that involves forming a mask layer on the back surface of the wafer, etching to create a recess, and then forming an interconnecting wire on the back surface.

Career Highlights

Throughout his career, Hsin-Ya Peng has worked with various companies, including Touch Micro-system Technology Corporation and Touch Micro-systems Technology Inc. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in the semiconductor industry.

Collaborations

Hsin-Ya has collaborated with several talented individuals in his field, including Shih-Feng Shao and Chen-Hsiung Yang. These collaborations have fostered innovation and have been instrumental in the development of new technologies.

Conclusion

Hsin-Ya Peng's contributions to wafer bonding technologies demonstrate his expertise and commitment to innovation in the semiconductor industry. His patents reflect a deep understanding of the complexities involved in wafer processing, making him a valuable figure in this field.