The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2007

Filed:

Jan. 20, 2005
Applicants:

Shih-feng Shao, Taipei Hsien, TW;

Hsin-ya Peng, Taipei Hsien, TW;

Chen-hsiung Yang, Taipei Hsien, TW;

Inventors:

Shih-Feng Shao, Taipei Hsien, TW;

Hsin-Ya Peng, Taipei Hsien, TW;

Chen-Hsiung Yang, Taipei Hsien, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A first wafer is provided, and a photosensitive masking-and-bonding pattern is formed on the surface of the first wafer. Then, an etching process using the photosensitive masking-and-bonding pattern as a hard mask is performed to form a wafer pattern on the surface of the first wafer. Finally, the first wafer is bonded to a second wafer with the photosensitive masking-and-bonding pattern.


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