The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7510947 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 31, 2009

Filed:

Jul. 03, 2006
Applicants:

Shih-feng Shao, Taipei Hsien, TW;

Ming-yen Chiu, Ping-Tung Hsien, TW;

Inventors:

Shih-Feng Shao, Taipei Hsien, TW;

Ming-Yen Chiu, Ping-Tung Hsien, TW;

Assignee:

Touch Micro-System Technology Inc., Yangmei Township, Taoyuan County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/46 (2006.01);
U.S. Cl.
CPC ...
Abstract

A cap wafer with patterned film formed thereon is etched through areas not covered by the patterned film to form a plurality of openings. Then, the cap wafer is bonded to a transparent wafer, and the cap wafer around the pattern film is segmented to form a plurality of cap structures. A device wafer with a plurality of devices and a plurality of contact pads electrically connected to the devices is subsequently provided. The cap structures and the device wafer are hermetically sealed to form a plurality of hermetic windows on the devices.


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Shao, Shih-Feng. (2009). Method for wafer level packaging and fabricating cap structures (U.S. Patent No. 7510947). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7510947

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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