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For the Inventor, By the Inventor

Petaluma, CA, United States of America

Tegal Corporation


USPTO Granted Patents = 95


Forward Citations = 5,941

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53 inventors (with patents filed for the assignee):

goldMedal Stephen P DeOrnellas (23 out of 24 patents)

silverMedal Tue H Nguyen (21 out of 98 patents)

bronzeMedal Leslie G Jerde (14 out of 15 patents)

4.  Alferd Cofer (13 out of 14 patents)

5.  Tai Dung Nguyen (11 out of 34 patents)

6.  Craig Alan Bercaw (9 out of 13 patents)

7.  Robert C Vail (8 out of 8 patents)

8.  Kurt A Olson (8 out of 9 patents)

9.  Robert A Ditizio (7 out of 11 patents)

10.  Roger B Lachenbruch (6 out of 7 patents)

11.  John P Zajac (6 out of 51 patents)

12.  Ninko T Mirkovich (6 out of 6 patents)

13.  David J Drage (5 out of 7 patents)

14.  Paritosh Rajora (4 out of 4 patents)

15.  Georges J Gorin (4 out of 6 patents)


Core Competencies:
Plasma Etching
Semiconductor Processing
Nanolayer Deposition
Chemical Vapor Deposition
Reactive Sputtering
Wafer Processing
Etch Stop Process
Plasma Enhanced Deposition
Critical Dimension Control
Cluster Tool Technology
Multilayer Structures
Electrical Component Integration

95 patents:

1. 7892980 - Apparatus and a method for controlling the depth of etching during alternating plasma etching of semiconductor substrates (2011-02-22),
2. 7867905 - System and method for semiconductor processing (2011-01-11),
3. 7713592 - Nanolayer deposition process (2010-05-11),
4. 7678705 - Plasma semiconductor processing system and method (2010-03-16),
5. 7645618 - Dry etch stop process for eliminating electrical shorting in MRAM device structures (2010-01-12),
6. 7467598 - System for, and method of, etching a surface on a wafer (2008-12-23),
7. 7442615 - Semiconductor processing system and method (2008-10-28),
8. 7439188 - Reactor with heated and textured electrodes and surfaces (2008-10-21),
9. 7425224 - High pressure chemical vapor trapping method (2008-09-16),
10. 7361387 - Plasma enhanced pulsed layer deposition (2008-04-22),
11. 7270729 - System for, and method of, etching a surface on a wafer (2007-09-18),
12. 7235484 - Nanolayer thick film processing system and method (2007-06-26),
13. 7223699 - Plasma etch reactor and method (2007-05-29),
14. 7208396 - Permanent adherence of the back end of a wafer to an electrical component or sub-assembly (2007-04-24),
15. 7179350 - Reactive sputtering of silicon nitride films by RF supported DC magnetron (2007-02-20),
Tegal Corporation is a semiconductor equipment manufacturing company specializing in providing process solutions for advanced wafer processing applications. With over 45 years of experience, Tegal offers a wide range of deposition, etch, and surface preparation systems for MEMS, IoT, power devices, RF, and other emerging markets. Their innovative solutions enable customers to achieve high quality, high throughput, and cost-effective manufacturing processes.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 30 2025

95 Patents

#3 in

#3,813 in

#7,885 in the World

...
Petaluma, CA, United States of America

Tegal Corporation

Forward Citations = 5,941

53 inventors:

goldMedal Stephen P DeOrnellas (23 out of 24 patents)

silverMedal Tue H Nguyen (21 out of 98 patents)

bronzeMedal Leslie G Jerde (14 out of 15 patents)

4.  Alferd Cofer (13 out of 14 patents)

5.  Tai Dung Nguyen (11 out of 34 patents)

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