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Hsinchu, Taiwan

Taimide Technology Incorporation

USPTO Granted Patents = 16

Trademarks = 1

Forward Citations = 10

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18 inventors (with patents filed for the assignee):

Chih-Wei Lin (5 out of 244 patents)

Meng-Ying Tsai (4 out of 4 patents)

Jia-Hao Wu (3 out of 3 patents)

4. Yen-Po Huang (3 out of 3 patents)

5. Chun-Ting Lai (3 out of 5 patents)

6. Yi-Hsueh Ho (3 out of 3 patents)

7. Tsung-Hsien Tsai (2 out of 2 patents)

8. Sheng-Yu Huang (2 out of 3 patents)

9. Yu-Chen Lai (1 out of 1 patent)

10. Wu-Yung Yang (1 out of 1 patent)

11. Chung-Ting Lai (1 out of 1 patent)

12. Paul S C Wu (1 out of 1 patent)

13. Chung-Yi Chen (1 out of 26 patents)

14. Chia-Ying Chou (1 out of 1 patent)

15. Chun-Yi Cheng (1 out of 1 patent)

16 patents: Sort by Forward Citations

1. 12742046 - Method for manufacturing polyimide film with reduced gloss (2026-09-22),

2. 12404380 - High-modulus black matte polyimide film (2025-09-02),

3. 12384919 - Polymer film and method for manufacturing the same (2025-08-12),

4. 11926705 - Black matte polyimide film (2024-03-12),

5. 11732160 - Composite film for use in LED wafer-level packaging process (2023-08-22),

6. 11655348 - Method for manufacturing polyimide composite film for flexible metal-clad substrate (2023-05-23),

7. 11597880 - Polymer film and method for manufacturing the same (2023-03-07),

8. 10501325 - Fabrication of a graphite film based on a polyimide film (2019-12-10),

9. 10334738 - Flexible substrate assembly and its application for fabricating flexible printed circuits (2019-06-25),

10. 10212821 - Flexible substrate assembly and its application for fabricating flexible printed circuits (2019-02-19),

11. 10040939 - Polyimide film having a low dielectric constant and a low gloss, and method of fabricating the same (2018-08-07),

12. 9914841 - Polyimide film incorporating a colored polyimide matting power and manufacture thereof (2018-03-13),

13. 9850401 - Multilayered polyimide film having a low dielectric constant, laminate structure including the same and manufacture thereof (2017-12-26),

14. 9839136 - Fabrication of a flexible circuit board (2017-12-05),

15. 9284424 - Polyimide film and fabrication method thereof (2016-03-15),

Company Overview

Taimide Technology Incorporation is a prominent player in the semiconductor industry, specializing in the development and manufacturing of advanced materials for electronic applications. The company focuses on innovative solutions for the production of displays and integrated circuits, contributing significantly to the advancement of technology in these fields. Headquartered in Hsinchu, Taiwan, Taimide is well-positioned within a key region for semiconductor research and development, fostering collaboration and growth in the tech ecosystem.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

16 Patents

#187 in Hsinchu

#994 in Taiwan

#37,788 in the World

Hsinchu, Taiwan

Taimide Technology Incorporation

Forward Citations = 10

18 inventors:

Chih-Wei Lin (5 out of 244 patents)

Meng-Ying Tsai (4 out of 4 patents)

Jia-Hao Wu (3 out of 3 patents)

4. Yen-Po Huang (3 out of 3 patents)

5. Chun-Ting Lai (3 out of 5 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Taimide Technology Incorporation. Retrieved from https://idiyas.com/company/taimide-technology-in

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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