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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9850401 B1

PDFFull Text
Date of Patent:
Dec. 26, 2017

Filed:

Dec. 04, 2014

Multilayered polyimide film having a low dielectric constant, laminate structure including the same and manufacture thereof

Applicant:

Taimide Technology Incorporation, Xinpu Township, TW;

Inventors:

Chung-Ting Lai, Hsinchu Hsien, TW;

Chih-Wei Lin, Hsinchu Hsien, TW;

Assignee:

Taimide Technology Incorporation, Hsinchu County, TW;

Attorney:

Baker & McKenzie LLP

Primary Examiner:

Doris Lee

Int. Cl.
CPC ...
C09D 179/08 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 27/32 (2006.01); H05K 1/03 (2006.01); H05K 3/38 (2006.01); C08G 73/10 (2006.01); B32B 38/00 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
C09D 179/08 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/281 (2013.01); B32B 27/322 (2013.01); C08G 73/1039 (2013.01); C08G 73/1042 (2013.01); C08G 73/1053 (2013.01); C08G 73/1071 (2013.01); H05K 1/036 (2013.01); H05K 3/381 (2013.01); B32B 2038/0016 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); B32B 2307/306 (2013.01); B32B 2307/714 (2013.01); B32B 2311/00 (2013.01); B32B 2379/08 (2013.01); B32B 2457/08 (2013.01); H05K 3/022 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0212 (2013.01); Y10T 428/2495 (2015.01); Y10T 428/254 (2015.01); Y10T 428/259 (2015.01); Y10T 428/31544 (2015.04);
Abstract

A multilayered polyimide film includes a first polyimide layer containing fluorine-containing polymer particles and having a first surface and a second surface, and a second polyimide layer and a third polyimide layer respectively disposed on the first surface and the second surface. The second and the third polyimide layers contain organic silicon oxygen compound particles. The multilayered polyimide film has a coefficient of thermal expansion (CTE) between about 13 and about 30 ppm/° C.

Find Patent Forward Citations

Lai, Chung-Ting. (2017). Multilayered polyimide film having a low dielectric constant, laminate structure including the same and manufacture thereof (U.S. Patent No. 9850401). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9850401

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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