Chung-Ting Lai

Title: Innovations of Chung-Ting Lai in Multilayered Polyimide Film Technology

Introduction

Chung-Ting Lai is a notable inventor based in Hsinchu Hsien, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of advanced polyimide films. His work focuses on creating innovative solutions that enhance the performance of electronic components.

Latest Patents

Chung-Ting Lai holds a patent for a multilayered polyimide film that features a low dielectric constant. The patent describes a multilayered polyimide film that includes a first polyimide layer containing fluorine-containing polymer particles. This layer has a first surface and a second surface, with a second polyimide layer and a third polyimide layer disposed on the respective surfaces. The second and third layers contain organic silicon oxygen compound particles. This innovative film has a coefficient of thermal expansion (CTE) ranging between about 13 and about 30 ppm/°C, making it suitable for various electronic applications.

Career Highlights

Chung-Ting Lai is associated with Taimide Technology Incorporation, where he applies his expertise in polymer technology. His work at Taimide has positioned him as a key player in the development of materials that meet the demands of modern electronics.

Collaborations

Chung-Ting Lai collaborates with Chih-Wei Lin, contributing to advancements in their field. Their partnership exemplifies the importance of teamwork in driving innovation.

Conclusion

Chung-Ting Lai's contributions to the development of multilayered polyimide films highlight his role as an influential inventor in the materials science sector. His innovative approaches continue to impact the electronics industry positively.