Hsinchu Hsien, Taiwan

Chun-Ting Lai

USPTO Granted Patents = 5 

Average Co-Inventor Count = 2.4

ph-index = 1

Forward Citations = 5(Granted Patents)


Location History:

  • Hsinchu, TW (2019 - 2021)
  • Hsinchu Hsien, TW (2017 - 2023)

Company Filing History:


Years Active: 2017-2023

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5 patents (USPTO):Explore Patents

Title: Innovations of Chun-Ting Lai

Introduction

Chun-Ting Lai is a notable inventor based in Hsinchu Hsien, Taiwan. He has made significant contributions to the field of adhesive technologies, particularly in applications related to LED packaging. With a total of five patents to his name, his work has garnered attention in the industry.

Latest Patents

One of Chun-Ting Lai's latest patents is a composite film designed for use in the LED wafer-level packaging process. This innovative film facilitates the adhesion of an LED wafer to a carrier, enhancing the efficiency of the packaging process. The composite film features a substrate with a heat-resisting pressure-sensing adhesive on one side, allowing the LED wafer to adhere securely. On the opposite side, a heat-resisting thermally-visbreaking pressure-sensing adhesive is applied, which reduces its adhesiveness strength during a heating process. This design enables easy detachment of the carrier from the composite film after the packaging process is completed.

Another significant patent involves a thermal-curable adhesive composition and adhesive sheet. This composition exhibits a remarkable rate of change of adhesion, ranging from 80% to 98%. The formula is defined by the equation V=[(V0−V1)/V0]×100, where V represents the rate of change of adhesion, V0 is the adhesion at room temperature, and V1 is the adhesion after being heated and then cooled. This innovation has potential applications in various adhesive technologies.

Career Highlights

Chun-Ting Lai has worked with Taimide Technology Incorporation and Taimide Tech. Inc., where he has contributed to the development of advanced adhesive solutions. His expertise in adhesive technologies has positioned him as a key player in the industry.

Collaborations

Chun-Ting Lai has collaborated with notable colleagues, including Chih-Wei Lin and Paul S C Wu. These partnerships have further enhanced his innovative capabilities and contributed to the success of his projects.

Conclusion

Chun-Ting Lai's contributions to adhesive technologies, particularly in LED packaging, demonstrate his innovative spirit and technical expertise. His patents reflect a commitment to advancing the field and improving manufacturing processes.

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