The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Aug. 29, 2016
Applicant:

Taimide Technology Incorporation, Hsinchu County, TW;

Inventors:

Paul S. C. Wu, Hsinchu Hsien, TW;

Chun-Ting Lai, Hsinchu Hsien, TW;

Yen-Po Huang, Hsinchu Hsien, TW;

Sheng-Yu Huang, Hsinchu Hsien, TW;

Assignee:

Taimide Technology Incorporation, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); H05K 3/022 (2013.01); H05K 3/281 (2013.01); H05K 2201/0154 (2013.01); H05K 2203/0264 (2013.01);
Abstract

The present disclosure relates, according to some embodiments, to the fabrication of a flexible circuit board, which includes forming a base layer comprising polyimide, forming a polyimide layer on the base layer, the polyimide layer having a first surface and a second surface opposite to each other, the first surface being peelably adhered in contact with the base layer, forming a metal layer on the second surface of the polyimide layer, and peeling the base layer from the polyimide layer with the metal layer remaining on the second surface of the polyimide layer.


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