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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10947417 B1

PDFFull Text
Date of Patent:
Mar. 16, 2021

Filed:

Sep. 29, 2017

Thermal-curable adhesive composition and adhesive sheet

Applicant:

Taimide Tech. Inc., Hsinchu, TW;

Inventors:

Chih-Wei Lin, Hsinchu, TW;

Chun-Ting Lai, Hsinchu, TW;

Assignee:

TAIMIDE TECH. INC., Hsinchu, TW;

Attorney:

Li & Cai Intellectual Property (USA) Office

Primary Examiner:

Samir Shah

Assistant Examiner:

Tong Guo

Int. Cl.
CPC ...
C09J 4/06 (2006.01); C09J 7/02 (2006.01); B32B 7/12 (2006.01); C09J 7/29 (2018.01); C09J 7/30 (2018.01); C08F 265/06 (2006.01);
U.S. Cl.
CPC ...
C09J 4/06 (2013.01); B32B 7/12 (2013.01); C08F 265/06 (2013.01); C09J 7/0203 (2013.01); C09J 7/29 (2018.01); C09J 7/30 (2018.01); B32B 2305/72 (2013.01); B32B 2309/105 (2013.01); C09J 2203/326 (2013.01); C09J 2301/312 (2020.08); C09J 2301/314 (2020.08); C09J 2433/00 (2013.01); C09J 2451/00 (2013.01); C09J 2479/086 (2013.01);
Abstract

The instant disclosure provides a thermal-curable adhesive composition and adhesive sheet. The thermal-curable adhesive composition has a rate of change of adhesion ranging from 80% to 98% and defined by the following equation: V=[(V0−V1)/V0]×100, wherein V is the rate of change of adhesion of the thermal-curable adhesive composition, V0 is the adhesion of the thermal-curable adhesive composition under room temperature, and V1 is the adhesion of the thermal-curable adhesive composition after being heated to a predetermined temperature then cooled to the room temperature.

Find Patent Forward Citations

Lin, Chih-Wei. (2021). Thermal-curable adhesive composition and adhesive sheet (U.S. Patent No. 10947417). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10947417

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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