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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10212821 B1

PDFFull Text
Date of Patent:
Feb. 19, 2019

Filed:

Nov. 30, 2016

Flexible substrate assembly and its application for fabricating flexible printed circuits

Applicant:

Taimide Technology Incorporation, Hsinchu County, TW;

Inventors:

Yen-Po Huang, Hsinchu Hsien, TW;

Tsung-Hsien Tsai, Hsinchu Hsien, TW;

Assignee:

Taimide Technology Incorporation, Hsinchu County, TW;

Attorney:

Baker & McKenzie LLP

Primary Examiner:

Sonya M Sengupta

Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); C03C 17/34 (2006.01); H01L 21/683 (2006.01); C08G 73/10 (2006.01); C08L 79/08 (2006.01); C09D 179/08 (2006.01); H01L 23/498 (2006.01); C08L 27/18 (2006.01); C08K 5/544 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); C03C 17/3405 (2013.01); C08G 73/105 (2013.01); C08G 73/1071 (2013.01); C08L 79/08 (2013.01); C09D 179/08 (2013.01); H01L 21/6835 (2013.01); H01L 23/4985 (2013.01); H01L 23/49894 (2013.01); H05K 1/0393 (2013.01); H05K 3/4682 (2013.01); H05K 3/4691 (2013.01); C03C 2218/11 (2013.01); C03C 2218/32 (2013.01); C08G 73/1039 (2013.01); C08G 73/1067 (2013.01); C08L 2203/20 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68386 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/05 (2013.01); H05K 2203/016 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/0264 (2013.01);
Abstract

A method of fabricating a flexible printed circuit includes providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other, forming a flexible substrate on the carrying support, the formed flexible substrate being adhered in contact with the release layer, applying one or more processing step on the flexible substrate while the flexible substrate is supported by the carrying support, and peeling the flexible substrate with an electric circuit formed thereon from the release layer while the release layer remains adhered in contact with the support base.

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