Company Filing History:
Years Active: 2019
Title: The Innovations of Tsung-Hsien Tsai
Introduction
Tsung-Hsien Tsai is a notable inventor based in Hsinchu Hsien, Taiwan. He has made significant contributions to the field of flexible printed circuits, holding two patents that showcase his innovative approach to technology.
Latest Patents
One of Tsai's latest patents is titled "Flexible substrate assembly and its application for fabricating flexible printed circuits." This patent describes a method of fabricating a flexible substrate assembly that involves forming a first polyimide layer on a rigid support base. The process includes incorporating an adhesion promoting agent and a release agent into a polyamic acid solution to achieve different adhesion strengths on opposite sides of the first polyimide layer. Additionally, a flexible second polyimide layer is formed on the first layer, allowing for easy peeling while maintaining adhesion to the support base. Another patent focuses on a method of fabricating a flexible printed circuit, which includes providing a carrying support made of a rigid base and a release layer. The flexible substrate is formed on this support, and after processing, it can be peeled away with the electric circuit intact.
Career Highlights
Tsung-Hsien Tsai works at Taimide Technology Incorporation, where he continues to develop innovative solutions in the field of flexible electronics. His work has contributed to advancements in the manufacturing processes of flexible printed circuits, enhancing their application in various technologies.
Collaborations
Tsai collaborates with Yen-Po Huang, furthering the research and development efforts at Taimide Technology Incorporation. Their combined expertise plays a crucial role in the company's innovative projects.
Conclusion
Tsung-Hsien Tsai's contributions to the field of flexible printed circuits through his patents and work at Taimide Technology Incorporation highlight his role as a significant inventor in the industry. His innovative methods are paving the way for advancements in flexible electronics.