Hsinchu Hsien, Taiwan

Chia-Ying Chou

USPTO Granted Patents = 1 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Chia-Ying Chou

Introduction

Chia-Ying Chou is a notable inventor based in Hsinchu Hsien, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of advanced composite films. His work is characterized by a focus on enhancing the properties of flexible substrates used in various applications.

Latest Patents

Chia-Ying Chou holds a patent for a "Method for manufacturing polyimide composite film for flexible metal-clad substrate." This innovative method involves several steps, including providing a polyamide acid solution, mixing fluorine polymer particles with a dispersant and an organic solution to create a dispersion, forming a colloidal polyimide film, and finally coating it with the fluorine polymer particle dispersion before baking to produce a polyimide composite film. This patent highlights his expertise in creating materials that can improve the performance of flexible electronics.

Career Highlights

Chia-Ying Chou is associated with Taimide Technology Incorporation, where he applies his knowledge and skills to advance the company's technological capabilities. His work has contributed to the development of high-performance materials that are essential in modern electronic devices.

Collaborations

Chia-Ying Chou collaborates with talented individuals such as Jia-Hao Wu and Chun-Yi Cheng. These partnerships enhance the innovative potential of their projects and contribute to the success of their endeavors in the field of materials science.

Conclusion

Chia-Ying Chou's contributions to the field of materials science, particularly through his patented methods, demonstrate his commitment to innovation. His work at Taimide Technology Incorporation and collaborations with other professionals further solidify his role as a key figure in advancing technology.

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