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For the Inventor, By the Inventor

Guangdong, China

Shengyi Technology Co., Ltd.


USPTO Granted Patents = 69

% Expired Patents = 36.2


Trademarks = 1

Forward Citations = 27

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63 inventors (with patents filed for the assignee):

goldMedal Xianping Zeng (16 out of 16 patents)

silverMedal Yongjing Xu (16 out of 17 patents)

bronzeMedal Zhongqiang Yang (10 out of 12 patents)

4.  Qianfa Liu (8 out of 9 patents)

5.  Guangbing Chen (8 out of 8 patents)

6.  Kehong Fang (8 out of 8 patents)

7.  Yueshan He (7 out of 10 patents)

8.  Zengbiao Huang (7 out of 7 patents)

9.  Shanyin Yan (6 out of 6 patents)

10.  Jiang You (6 out of 6 patents)

11.  Chiji Guan (5 out of 5 patents)

12.  Liexiang He (5 out of 5 patents)

13.  Guofang Tang (5 out of 6 patents)

14.  Songgang Chai (5 out of 6 patents)

15.  Hui Li (5 out of 30 patents)


Core Competencies:
Resin Composition
Prepreg
Thermosetting Resin
Printed Circuit Board
Halogen-Free
Composite
High-Frequency Circuit
Flexible Metal Laminate
Polyimide Resin
Adhesive Film
Benzoxazine
Degradable Resin

69 patents:

1. 12466937 - Resin composition and use thereof (2025-11-11),
2. 12378386 - Resin composition and application thereof (2025-08-05),
3. 12234325 - Resin composition, prepreg, laminate, metal foil-clad laminate, and printed circuit board (2025-02-25),
4. 12234318 - Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition (2025-02-25),
5. 12187887 - Resin composition, prepreg, laminate and metal foil-clad laminate (2025-01-07),
6. 12122904 - Thermosetting resin composition and prepreg, laminate and printed circuit board using same (2024-10-22),
7. 12104054 - Resin composition, prepreg containing same, laminate, and printed circuit board (2024-10-01),
8. 11975507 - Thermosetting resin composition, prepreg containing same, metal foil-clad laminate and printed circuit board (2024-05-07),
9. 11970591 - Resin composition, prepreg for printed circuit and metal-coated laminate (2024-04-30),
10. 11945924 - Fluorine-containing resin composition, and resin vanish, fluorine-containing dielectric sheet, laminate, copper clad laminate and printed circuit board containing the same (2024-04-02),
11. 11930595 - Circuit material and circuit board containing the same (2024-03-12),
12. 11744013 - Composite, high-frequency circuit substrate prepared therefrom and process for preparing the same (2023-08-29),
13. 11732123 - Thermosetting resin composition, and prepreg, laminate and printed circuit board using same (2023-08-22),
14. 11661378 - Boron nitride agglomerate, thermosetting resin composition containing same, and use thereof (2023-05-30),
15. 11649351 - Resin composition for a metal substrate, and resin varnish and metal base copper-clad laminate comprising the same (2023-05-16),
Company Overview
Shengyi Technology Co., Ltd., based in Guangdong, China, specializes in the development and manufacturing of advanced resin compositions. The company focuses on a range of core technologies, including prepreg materials, thermosetting resins, and halogen-free solutions, which are essential for high-performance printed circuit boards. Shengyi is also engaged in producing composite materials and flexible metal laminates, catering to the growing demands of high-frequency circuit applications in various industries.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 13 2026

69 Patents

#4 in Guangdong

#479 in China

#10,763 in the World

Guangdong, CN
Guangdong, China

Shengyi Technology Co., Ltd.

Forward Citations = 27

63 inventors:

goldMedal Xianping Zeng (16 out of 16 patents)

silverMedal Yongjing Xu (16 out of 17 patents)

bronzeMedal Zhongqiang Yang (10 out of 12 patents)

4.  Qianfa Liu (8 out of 9 patents)

5.  Guangbing Chen (8 out of 8 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Shengyi Technology Co., Ltd.. Retrieved from https://idiyas.com/company/shengyi-technology-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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