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Guangdong, China

Shengyi Technology Co., Ltd.

USPTO Granted Patents = 69

EPO Patents = 44

Trademarks = 1

Forward Citations = 21

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63 inventors (with patents filed for the assignee):

Xianping Zeng (16 out of 16 patents)

Yongjing Xu (16 out of 16 patents)

Zhongqiang Yang (10 out of 12 patents)

4. Qianfa Liu (8 out of 8 patents)

5. Guangbing Chen (8 out of 8 patents)

6. Kehong Fang (8 out of 8 patents)

7. Yueshan He (7 out of 10 patents)

8. Zengbiao Huang (7 out of 7 patents)

9. Shanyin Yan (6 out of 6 patents)

10. Jiang You (6 out of 6 patents)

11. Chiji Guan (5 out of 5 patents)

12. Liexiang He (5 out of 5 patents)

13. Guofang Tang (5 out of 6 patents)

14. Songgang Chai (5 out of 6 patents)

15. Hui Li (5 out of 28 patents)

Core Competencies:

Thermosetting Resin Composition

Prepreg

Printed Circuit Board

Halogen-Free Epoxy Resin

Polyphenyl Ether Resin

Flexible Metal Laminate

High-Frequency Circuit Substrate

Benzoxazine-Containing Resin

Degradable Resin Composition

Siloxane-Modified Cyclotriphosphazene

Organic Silicone Resin

69 patents: Sort by Forward Citations

1. 12466937 - Resin composition and use thereof (2025-11-11),

2. 12378386 - Resin composition and application thereof (2025-08-05),

3. 12234325 - Resin composition, prepreg, laminate, metal foil-clad laminate, and printed circuit board (2025-02-25),

4. 12234318 - Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition (2025-02-25),

5. 12187887 - Resin composition, prepreg, laminate and metal foil-clad laminate (2025-01-07),

6. 12122904 - Thermosetting resin composition and prepreg, laminate and printed circuit board using same (2024-10-22),

7. 12104054 - Resin composition, prepreg containing same, laminate, and printed circuit board (2024-10-01),

8. 11975507 - Thermosetting resin composition, prepreg containing same, metal foil-clad laminate and printed circuit board (2024-05-07),

9. 11970591 - Resin composition, prepreg for printed circuit and metal-coated laminate (2024-04-30),

10. 11945924 - Fluorine-containing resin composition, and resin vanish, fluorine-containing dielectric sheet, laminate, copper clad laminate and printed circuit board containing the same (2024-04-02),

11. 11930595 - Circuit material and circuit board containing the same (2024-03-12),

12. 11744013 - Composite, high-frequency circuit substrate prepared therefrom and process for preparing the same (2023-08-29),

13. 11732123 - Thermosetting resin composition, and prepreg, laminate and printed circuit board using same (2023-08-22),

14. 11661378 - Boron nitride agglomerate, thermosetting resin composition containing same, and use thereof (2023-05-30),

15. 11649351 - Resin composition for a metal substrate, and resin varnish and metal base copper-clad laminate comprising the same (2023-05-16),

Shengyi Technology Co., Ltd. (SYTECH) is a leading manufacturer and supplier of high-quality printed circuit boards (PCBs) and copper clad laminates (CCLs) worldwide. With a strong commitment to innovation and continuous improvement, SYTECH offers a wide range of advanced PCB and CCL products for various industries. The company's cutting-edge technology, strict quality control, and exceptional customer service make it a trusted partner for businesses seeking reliable PCB and CCL solutions. Visit SYTECH's website to learn more about their products and services.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

69 Patents

#17 in Guangdong

#424 in China

#10,482 in the World

Guangdong, China

Shengyi Technology Co., Ltd.

Forward Citations = 21

63 inventors:

Xianping Zeng (16 out of 16 patents)

Yongjing Xu (16 out of 16 patents)

Zhongqiang Yang (10 out of 12 patents)

4. Qianfa Liu (8 out of 8 patents)

5. Guangbing Chen (8 out of 8 patents)

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