The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2024

Filed:

Mar. 31, 2020
Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Huayong Fan, Guangdong, CN;

Zengbiao Huang, Guangdong, CN;

Yongjing Xu, Guangdong, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 47/00 (2006.01); B32B 15/20 (2006.01); C08J 5/04 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 15/14 (2006.01);
U.S. Cl.
CPC ...
C08L 47/00 (2013.01); B32B 15/20 (2013.01); C08J 5/043 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/26 (2013.01); B32B 15/14 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/204 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/7265 (2013.01); B32B 2307/748 (2013.01); B32B 2457/08 (2013.01); C08J 2345/00 (2013.01); C08J 2347/00 (2013.01); C08J 2445/00 (2013.01); C08J 2447/00 (2013.01); C08J 2471/12 (2013.01); C08L 2201/08 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01);
Abstract

Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.


Find Patent Forward Citations

Fan, Huayong. (2024). Thermosetting resin composition and prepreg, laminate and printed circuit board using same (U.S. Patent No. 12122904). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12122904

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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