The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2024

Filed:

Apr. 08, 2019
Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Liexiang He, Guangdong, CN;

Yongnian Qi, Guangdong, CN;

Xianping Zeng, Guangdong, CN;

Zhongqiang Yang, Guangdong, CN;

Hualin Pan, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/04 (2006.01); C08J 5/24 (2006.01); C08K 3/013 (2018.01); C08K 5/00 (2006.01);
U.S. Cl.
CPC ...
C08L 63/04 (2013.01); C08J 5/244 (2021.05); C08J 5/249 (2021.05); C08K 3/013 (2018.01); C08K 5/0066 (2013.01); C08J 2363/04 (2013.01); C08L 2201/02 (2013.01); C08L 2203/20 (2013.01);
Abstract

The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.


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