The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2024
Filed:
Dec. 25, 2018
Applicant:
Shengyi Technology Co., Ltd., Guangdong, CN;
Inventors:
Yundong Meng, Guangdong, CN;
Kehong Fang, Guangdong, CN;
Assignee:
Shengyi Technology Co., Ltd., Guangdong, CN;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); B32B 5/02 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); C08L 9/00 (2006.01); C08L 9/06 (2006.01); C08L 71/12 (2006.01); C08L 83/16 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08J 5/244 (2021.05); B32B 5/02 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08L 9/00 (2013.01); C08L 9/06 (2013.01); C08L 71/12 (2013.01); C08L 83/16 (2013.01); H05K 1/0366 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2264/1021 (2020.08); B32B 2307/3065 (2013.01); B32B 2457/08 (2013.01); C08J 2309/00 (2013.01); C08J 2309/06 (2013.01); C08J 2371/12 (2013.01); C08J 2383/16 (2013.01); C08J 2409/00 (2013.01); C08J 2409/06 (2013.01); C08J 2471/12 (2013.01); C08J 2483/16 (2013.01); C08L 2201/02 (2013.01); C08L 2203/20 (2013.01); C08L 2205/03 (2013.01); H05K 2201/029 (2013.01);
Abstract
Provided is a resin composition, a prepreg for a printed circuit and a metal-coated laminate. The resin composition includes: a silicone aryne resin, a polyphenylene ether resin with unsaturated bonds, and a butadiene polymer. The resin composition is used such that the prepared metal-coated laminate can have at least one of the following characteristics: a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion.