The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Mar. 23, 2018
Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventor:

Zengbiao Huang, Guangdong, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/583 (2006.01); C08K 5/14 (2006.01); C08L 53/02 (2006.01); C08K 5/03 (2006.01); C08K 3/36 (2006.01); C04B 35/63 (2006.01); C08K 5/00 (2006.01); C08J 5/24 (2006.01); C01B 21/064 (2006.01); C08K 3/38 (2006.01);
U.S. Cl.
CPC ...
C04B 35/583 (2013.01); C01B 21/064 (2013.01); C04B 35/6316 (2013.01); C08J 5/24 (2013.01); C08K 3/36 (2013.01); C08K 5/0025 (2013.01); C08K 5/0066 (2013.01); C08K 5/03 (2013.01); C08K 5/14 (2013.01); C08L 53/02 (2013.01); C01P 2004/30 (2013.01); C01P 2004/50 (2013.01); C01P 2004/61 (2013.01); C01P 2004/62 (2013.01); C08K 2003/385 (2013.01);
Abstract

Provided is a boron nitride agglomerate. The boron nitride agglomerate is of a multi-stage structure formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions through adhesion of an inorganic binder. Further provided is a method for preparing the boron nitride agglomerate. The method comprises: mixing flaky hexagonal boron nitride primary particles with an inorganic binder, and controlling the mass of the inorganic binder to account for 0.02-20% of the mass of the flaky hexagonal boron nitride primary particles, so as to obtain the boron nitride agglomerate. The boron nitride agglomerate provided can be added to thermosetting resin compositions, and resin sheets, resin composite metal foil, prepregs, laminates, metal foil-covered laminates, and printed wiring boards prepared using the same have higher boron nitride addition, high thermal conductivity, and high peel strength.


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