The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Apr. 15, 2020
Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Naidong She, Guangdong, CN;

Zengbiao Huang, Guangdong, CN;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C09D 163/00 (2006.01); C09D 7/61 (2018.01); B32B 15/20 (2006.01); B32B 15/04 (2006.01); B32B 7/12 (2006.01); B32B 15/18 (2006.01); C09J 163/00 (2006.01); B32B 15/092 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B32B 7/12 (2013.01); B32B 15/043 (2013.01); B32B 15/092 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); C09D 7/61 (2018.01); C09D 163/00 (2013.01); C09J 163/00 (2013.01);
Abstract

The present disclosure provides a resin composition for a metal substrate, and a resin varnish and a metal base copper-clad laminate comprising the same. The resin composition comprises 5-40% of a main resin and 60-95% of a thermally conductive filler when the total weight of the resin composition is calculated as 100%, wherein the main resin comprises 60-90% of a flexible epoxy resin having a structure as shown in Formula I and 10-40% of a phenoxy resin when the total weight of the main resin is calculated as 100%. The resin composition provided by the present disclosure has a low modulus, can alleviate the stress generated by thermal shocks and can withstand more than 1000 thermal cycles.


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