Dongguan, China

Songgang Chai

This inventor holds 6 USPTO granted patents and 5 published patent applications and 1 EPO patent. Top assignees: Shengyi Technology Co., Ltd., Guangdong Shengyi Sci. Tech Co., Ltd.. Active years: 2016-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Songgang Chai. Retrieved from https://idiyas.com/inventor/songgang-chai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 83.3

 

Average Co-Inventor Count = 3.5

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Dongguan, CN (2018 - 2019)
  • Guangdong, CN (2016 - 2024)

Company Filing History:


Years Active: 2016-2025

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6 patents (USPTO):Explore Patents

Title: The Innovations of Songgang Chai

Introduction

Songgang Chai is a notable inventor based in Dongguan, China. He has made significant contributions to the field of resin compositions, holding a total of five patents. His work focuses on developing advanced materials that enhance the performance of printed circuit boards.

Latest Patents

One of Songgang Chai's latest patents is a resin composition and its application. This invention provides a resin composition that includes 15-39% cross-linkable curable resin and 61-85% filler, specifically silicon dioxide prepared through organosilicon hydrolysis. The silicon dioxide has an average particle diameter of 0.1-3 μm, with a purity greater than 99.9%. This resin composition is designed to produce adhesive films and resin-coated copper foils with high tensile strength, good drilling processability, and higher electric strength, making it suitable for multilayer laminates in printed circuit boards.

Another significant patent involves a fluorine-containing resin composition, which includes 30-70% of a fluorine-containing polymer and an inorganic filler with specific particle size distributions. This innovation ensures that the boards made from this resin composition exhibit excellent dielectric properties and voltage resistance, even with a high amount of inorganic filler.

Career Highlights

Songgang Chai has worked with prominent companies such as Shengyi Technology Co., Ltd. and Guangdong Shengyi Sci. Tech Co., Ltd. His experience in these organizations has allowed him to refine his expertise in resin technology and contribute to the advancement of materials used in electronics.

Collaborations

Some of his notable coworkers include Cuiming Du and Liangpeng Hao. Their collaboration has likely fostered an environment of innovation and creativity in their projects.

Conclusion

Songgang Chai's contributions to resin compositions and printed circuit board materials highlight his role as a significant inventor in the field. His patents reflect a commitment to advancing technology and improving material performance in electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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