Shengyi Technology Co., Ltd.

Guangdong Shengyi Sci. Tech Co., Ltd.

Songgang Chai

Qianfa Liu

Cuiming Du

Yongjing Xu

Yanhua Zhang

Liangpeng Hao

Zhongqiang Yang

Zengbiao Huang

Naidong She

Wei Liang

Dongliang Liu

Jinchao Dong

Qing Wang

A resin composition and the use thereof. The resin composition comprises the following components, in percentages by weight: 40-70% of a crosslinkable and curable resin and 30-60% of a filler. The filler is silicon dioxide prepared by means of an organosilicone hydrolysis method; the average particle size D50 of the silicon dioxide is 0.1-3 μm; and the particle size ratio D100:D10 of the silicon dioxide is less than or equal to 2.5. By means of the composition, a prepared adhesive film and resin-coated copper foil have a higher elongation rate, a higher peel strength, low CTE, low D, better drilling processability and higher electrical strength. A finer line processing capability can be achieved, which can be applied to a printed circuit board material of a multilayer laminate, in particular a printed circuit board material of a multilayer laminate of thin lines.

Resin composition and use thereof

The present invention provides a resin composition and an application thereof, the resin composition comprising the following components by weight percentage: 15-39% cross-linkable curable resin and 61-85% filler, the filler being silicon dioxide prepared by means of organosilicon hydrolysis, the average particle diameter D50 of the silicon dioxide being 0.1-3 μm, the ratio of D100:D10 thereof being less than or equal to 2.5, and the purity of the silicon dioxide being greater than 99.9%. The resin composition of the present invention can make prepared adhesive films and resin-coated copper foils have relatively high tensile strength and peel strength, relatively good drilling processability, controllable fluidity, good filling ability, and higher electric strength, and can achieve finer line processing ability; it is a printed circuit board material applicable to multilayer laminates, especially a printed circuit board material for multilayer laminates of thin lines.

Resin composition and application thereof

The present invention relates to a fluorine-containing resin composition, and a resin vanish, a fluorine-containing dielectric sheet, a laminate, a copper clad laminate and a printed circuit board containing the same. The fluorine-containing resin composition comprises 30 wt. %-70 wt. % of a fluorine-containing polymer, 30 wt. %-70 wt. % of an inorganic filler which includes the following particle size distribution: D10 is greater than 1.5 μm; and D50 is 10-15 μm. In the present invention, the selection of an inorganic filler with a specific particle size distribution can ensure that the boards prepared by the fluorine-containing resin composition have excellent dielectric properties and voltage resistance performance, even if the inorganic filler is added in a large amount.

Fluorine-containing resin composition, and resin vanish, fluorine-containing dielectric sheet, laminate, copper clad laminate and printed circuit board containing the same

A thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and an organomolybdenum compound is disclosed. The thermosetting resin composition may be used for preparing a resin vanish and a prepreg, wherein the prepreg is used for laminates and printed circuit boards.

Thermosetting resin composition and uses thereof

The present invention relates to a thermosetting resin composition. The composition comprises from about 20 wt. % to about 70 wt. % of a thermosetting resin, from about 1 wt. % to about 30 wt. % of a curing agent, from about 0 wt. % to about 10 wt. % of an accelerant, a tungsten compound, and an inorganic filler. A prepreg may be prepared in an impregnation manner or a coating product may be prepared in a coating manner. The composition may decrease the thermal expansion coefficient of laminates and may effectively block UV light and decrease the light transmissivity.

The present invention relates to an epoxy resin composition and a copper clad laminate manufactured by using same. The epoxy resin composition comprises the following components and weight percentages thereof: epoxy resin 20-70%, curing agent 1-30%, accelerator 0-10%, fluororesin micropowder filler 1-60% and inorganic filler 0-60%, and further comprises a suitable amount of solvent. The copper clad laminate manufactured by using the epoxy resin composition comprises a prepreg and copper foils covering two sides of the prepreg, the prepreg comprising a reinforced material and the epoxy resin composition, which is adhered to the reinforced material after dipping and drying. The copper clad laminate manufactured by using the epoxy resin composition has excellent comprehensive performance, low water absorption, conductive anodic-filament resistance and good processability and meets requirements for processing an assembling of printed circuit boards.

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Dongguan, China

Songgang Chai