The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2018
Filed:
Nov. 06, 2013
Applicant:
Shengyi Technology Co., Ltd., Dongguan, CN;
Inventors:
Cuiming Du, Dongguan, CN;
Songgang Chai, Dongguan, CN;
Assignee:
SHENGYI TECHNOLOGY CO., LTD., , CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K 5/5398 (2006.01); C08K 3/30 (2006.01); C08K 3/08 (2006.01); C08J 5/24 (2006.01); C08K 3/11 (2018.01); C08K 3/013 (2018.01); C08K 3/01 (2018.01); C08L 63/00 (2006.01); C08G 59/00 (2006.01); B32B 7/12 (2006.01); C08K 3/34 (2006.01); C08K 3/40 (2006.01); C08K 3/26 (2006.01); C08K 3/38 (2006.01); C08L 101/00 (2006.01); C08K 3/36 (2006.01); C08K 3/16 (2006.01); C08K 3/22 (2006.01); C08K 3/24 (2006.01); C08K 7/22 (2006.01); C08K 5/56 (2006.01); C08G 59/40 (2006.01); C08G 59/68 (2006.01); C08K 5/00 (2006.01); C08K 5/057 (2006.01); C08K 5/39 (2006.01);
U.S. Cl.
CPC ...
C08J 5/24 (2013.01); B32B 7/12 (2013.01); C08G 59/4021 (2013.01); C08G 59/686 (2013.01); C08K 3/01 (2018.01); C08K 3/013 (2018.01); C08K 3/11 (2018.01); C08K 3/16 (2013.01); C08K 3/22 (2013.01); C08K 3/24 (2013.01); C08K 3/26 (2013.01); C08K 3/30 (2013.01); C08K 3/34 (2013.01); C08K 3/36 (2013.01); C08K 3/38 (2013.01); C08K 3/40 (2013.01); C08K 5/0091 (2013.01); C08K 5/057 (2013.01); C08K 5/39 (2013.01); C08K 5/5398 (2013.01); C08K 5/56 (2013.01); C08K 7/22 (2013.01); C08L 63/00 (2013.01); C08L 101/00 (2013.01); B32B 2260/046 (2013.01); B32B 2264/102 (2013.01); B32B 2264/104 (2013.01); B32B 2307/306 (2013.01); B32B 2307/71 (2013.01); B32B 2307/714 (2013.01); C08J 2363/00 (2013.01); C08J 2363/02 (2013.01); C08K 2003/0887 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/3009 (2013.01);
Abstract
The present invention relates to a thermosetting resin composition. The composition comprises from about 20 wt. % to about 70 wt. % of a thermosetting resin, from about 1 wt. % to about 30 wt. % of a curing agent, from about 0 wt. % to about 10 wt. % of an accelerant, a tungsten compound, and an inorganic filler. A prepreg may be prepared in an impregnation manner or a coating product may be prepared in a coating manner. The composition may decrease the thermal expansion coefficient of laminates and may effectively block UV light and decrease the light transmissivity.