The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2019
Filed:
Oct. 11, 2013
Applicant:
Shengyi Technology Co., Ltd., Dongguan, CN;
Inventors:
Assignee:
SHENGYI TECHNOLOGY CO., LTD., Guangdong, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); C08K 5/5398 (2006.01); C08J 5/24 (2006.01); C08G 59/40 (2006.01); C08K 13/02 (2006.01); C08L 63/00 (2006.01); C08L 83/04 (2006.01); H05K 1/03 (2006.01); C08J 5/10 (2006.01); C08G 59/06 (2006.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01); C08K 5/05 (2006.01); C08K 5/39 (2006.01); C08G 59/24 (2006.01); C08G 59/68 (2006.01); B32B 15/08 (2006.01); B32B 27/20 (2006.01); C08L 61/04 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01);
U.S. Cl.
CPC ...
C08K 5/5398 (2013.01); B32B 15/08 (2013.01); B32B 27/20 (2013.01); C08G 59/063 (2013.01); C08G 59/245 (2013.01); C08G 59/40 (2013.01); C08G 59/4021 (2013.01); C08G 59/686 (2013.01); C08J 5/10 (2013.01); C08J 5/24 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C08K 5/05 (2013.01); C08K 5/39 (2013.01); C08K 13/02 (2013.01); C08L 61/04 (2013.01); C08L 63/00 (2013.01); C08L 83/04 (2013.01); H05K 1/0366 (2013.01); H05K 1/0373 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08J 2300/24 (2013.01); C08J 2363/00 (2013.01); C08J 2483/04 (2013.01); C08L 2203/20 (2013.01); C08L 2666/48 (2013.01); C08L 2666/72 (2013.01); H05K 1/0346 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/0206 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/068 (2013.01); H05K 2203/121 (2013.01);
Abstract
A thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and an organomolybdenum compound is disclosed. The thermosetting resin composition may be used for preparing a resin vanish and a prepreg, wherein the prepreg is used for laminates and printed circuit boards.