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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9475970 B1

PDFFull Text
Date of Patent:
Oct. 25, 2016

Filed:

Sep. 02, 2011

Epoxy resin composition and copper clad laminate manufactured by using same

Applicants:

Cuiming Du, Guangdong, CN;

Songgang Chai, Guangdong, CN;

Zhongqiang Yang, Guangdong, CN;

Inventors:

Cuiming Du, Guangdong, CN;

Songgang Chai, Guangdong, CN;

Zhongqiang Yang, Guangdong, CN;

Assignee:

GUANGDONG SHENGYI SCI. TECH CO., LTD., Guangdong, CN;

Attorney:

Norton Rose Fulbright US LLP

Primary Examiner:

Coris Fung

Int. Cl.
CPC ...
B32B 27/38 (2006.01); C09J 163/00 (2006.01); H05K 1/03 (2006.01); C08L 63/00 (2006.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01); C08L 27/12 (2006.01); B32B 15/20 (2006.01); B32B 17/04 (2006.01); B32B 15/14 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); B32B 7/12 (2013.01); B32B 15/043 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 17/04 (2013.01); C08L 27/12 (2013.01); C08L 63/00 (2013.01); H05K 1/0326 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/02 (2013.01); B32B 2262/06 (2013.01); B32B 2262/10 (2013.01); B32B 2262/101 (2013.01); B32B 2307/7265 (2013.01); B32B 2457/08 (2013.01); H05K 1/0373 (2013.01); H05K 3/022 (2013.01); Y10T 428/31522 (2015.04);
Abstract

The present invention relates to an epoxy resin composition and a copper clad laminate manufactured by using same. The epoxy resin composition comprises the following components and weight percentages thereof: epoxy resin 20-70%, curing agent 1-30%, accelerator 0-10%, fluororesin micropowder filler 1-60% and inorganic filler 0-60%, and further comprises a suitable amount of solvent. The copper clad laminate manufactured by using the epoxy resin composition comprises a prepreg and copper foils covering two sides of the prepreg, the prepreg comprising a reinforced material and the epoxy resin composition, which is adhered to the reinforced material after dipping and drying. The copper clad laminate manufactured by using the epoxy resin composition has excellent comprehensive performance, low water absorption, conductive anodic-filament resistance and good processability and meets requirements for processing an assembling of printed circuit boards.

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