logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12234318 B1

PDFFull Text
Date of Patent:
Feb. 25, 2025

Filed:

Mar. 31, 2020

Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition

Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Yong Chen, Guangdong, CN;

Yongjing Xu, Guangdong, CN;

Guofang Tang, Guangdong, CN;

Assignee:

SHENGYI TECHNOLOGY CO., LTD., , CN;

Attorney:

McDonald Hopkins LLC

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
B32B 15/092 (2006.01); B32B 7/12 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); B32B 27/38 (2006.01); C08G 59/40 (2006.01); C08G 59/42 (2006.01); C08J 5/24 (2006.01); C08K 3/22 (2006.01); C08K 3/32 (2006.01); C08K 3/36 (2006.01); C08K 5/5313 (2006.01); C08K 5/5377 (2006.01); C08K 5/5419 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01);
U.S. Cl.
CPC ...
C08G 59/4238 (2013.01); B32B 7/12 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08G 59/4223 (2013.01); C08G 59/4261 (2013.01); C08J 5/244 (2021.05); C08K 3/22 (2013.01); C08K 3/32 (2013.01); C08K 3/36 (2013.01); C08K 5/5313 (2013.01); C08K 5/5377 (2013.01); C08K 5/5419 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/26 (2013.01); B32B 2250/40 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2457/08 (2013.01); C08J 2363/00 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2241 (2013.01); C08K 2003/327 (2013.01); C08K 2201/003 (2013.01);
Abstract

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

Find Patent Forward Citations

Loading…