For the Inventor, By the Inventor

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Camas, WA, United States of America

Sharp Microelectronics Technology, Inc.

USPTO Granted Patents = 68

Forward Citations = 2,088

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54 inventors (with patents filed for the assignee):

Sheng Teng Hsu (16 out of 362 patents)

Tue H Nguyen (12 out of 98 patents)

Tatsuo Nakato (9 out of 11 patents)

4. Lawrence J Charneski (5 out of 28 patents)

5. Bruce Dale Ulrich (5 out of 42 patents)

6. Jong Jan Lee (4 out of 16 patents)

7. Douglas James Millar (4 out of 4 patents)

8. David R Evans (3 out of 109 patents)

9. Robert Gary Pollachek (3 out of 7 patents)

10. Jer-shen Maa (3 out of 96 patents)

11. Masato Kobayashi (3 out of 6 patents)

12. David A Vidusek (3 out of 4 patents)

13. Tai Won Youn (3 out of 4 patents)

14. Bryan Severt Hallberg (3 out of 3 patents)

15. Prem Lal Sood (2 out of 12 patents)

Core Competencies:

MOS Transistor

Chemical Vapor Deposition

CMOS Manufacturing

Ferroelectric Memory Cell

Digital Signal Processor

Battery Power Conservation

Multi-Level Photoresist

Copper Adhesion

Mobile Telecommunications

Silicon-Germanium Heterostructure

Low-Resistance Contacts

Retractable Antenna

68 patents: Sort by Forward Citations

1. 5932913 - MOS transistor with controlled shallow source/drain junction, (1999-08-03),

2. 5918150 - Method for a chemical vapor deposition of copper on an ion prepared (1999-06-29),

3. 5915199 - Method for manufacturing a CMOS self-aligned strapped interconnection (1999-06-22),

4. 5914202 - Method for forming a multi-level reticle (1999-06-22),

5. 5913144 - Oxidized diffusion barrier surface for the adherence of copper and (1999-06-15),

6. 5910673 - Locos MOS device for ESD protection (1999-06-08),

7. 5909637 - Copper adhesion to a diffusion barrier surface and method for same (1999-06-01),

8. 5907762 - Method of manufacture of single transistor ferroelectric memory cell (1999-05-25),

9. 5906910 - Multi-level photoresist profile method (1999-05-25),

10. 5904565 - Low resistance contact between integrated circuit metal levels and (1999-05-18),

11. 5900290 - Method of making low-k fluorinated amorphous carbon dielectric (1999-05-04),

12. 5897379 - Low temperature system and method for CVD copper removal (1999-04-27),

13. 5891782 - Method for fabricating an asymmetric channel doped MOS structure (1999-04-06),

14. 5891297 - System and method for peeling a polarized film (1999-04-06),

15. 5852769 - Cellular telephone audio input compensation system and method (1998-12-22),

Sharp Microelectronics Technology, Inc. is a leading provider of cutting-edge components and solutions in the electronics industry. With a focus on microelectronics and advanced technologies, Sharp offers a wide range of innovative products and services to enhance various applications. Their offerings include displays, sensors, memory devices, and communication modules. By continuously pushing the boundaries of technology, Sharp Microelectronics Technology, Inc. strives to enable customers to create innovative products that cater to the evolving needs of today's market.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

68 Patents

#1 in Camas, WA

#91 in Washington

#5,146 in US

#10,446 in the World

Camas, WA, United States of America

Sharp Microelectronics Technology, Inc.

Forward Citations = 2,088

54 inventors:

Sheng Teng Hsu (16 out of 362 patents)

Tue H Nguyen (12 out of 98 patents)

Tatsuo Nakato (9 out of 11 patents)

4. Lawrence J Charneski (5 out of 28 patents)

5. Bruce Dale Ulrich (5 out of 42 patents)

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