For the Inventor, By the Inventor

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Durham, NC, United States of America

Semprius, Inc.

USPTO Granted Patents = 26

% Expired Patents = 7.7

EPO Patents = 3

Forward Citations = 2,868

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25 inventors (with patents filed for the assignee):

Etienne Menard (19 out of 66 patents)

Christopher Andrew Bower (15 out of 230 patents)

Matthew Alexander Meitl (12 out of 224 patents)

4. Joseph Carr (5 out of 18 patents)

5. John A Rogers (5 out of 143 patents)

6. Michael Motala (3 out of 10 patents)

7. Jong-Hyun Ahn (3 out of 14 patents)

8. Sang-Il Park (3 out of 8 patents)

9. Chang-Jae Yu (3 out of 9 patents)

10. Heung Cho Ko (3 out of 29 patents)

11. Mark Stoykovich (3 out of 23 patents)

12. Jongseung Yoon (3 out of 14 patents)

13. Alfred J Baca (3 out of 36 patents)

14. Ralph G Nuzzo (3 out of 45 patents)

15. John W Hamer (3 out of 54 patents)

Core Competencies:

High-Yield Fabrication

Optical Systems

Surface Attachment

Transferable Components

Integrated Circuit Devices

Epitaxy

Through-Silicon Vias

Dry Transfer Printing

OLED Devices

Microstructured Surfaces

Active Components

26 patents: Sort by Forward Citations

1. 9660008 - High-yield fabrication of large-format substrates with distributed, independent control elements (2017-05-23),

2. 9603259 - Methods for surface attachment of flipped active components (2017-03-21),

3. 9601671 - Optical systems fabricated by printing-based assembly (2017-03-21),

4. 9496155 - Methods of selectively transferring active components (2016-11-15),

5. 9443883 - Methods of forming printable integrated circuit devices and devices formed thereby (2016-09-13),

6. 9412727 - Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion (2016-08-09),

7. 9401344 - Substrates with transferable chiplets (2016-07-26),

8. 9362113 - Engineered substrates for semiconductor epitaxy and methods of fabricating the same (2016-06-07),

9. 9355854 - Methods of fabricating printable compound semiconductor devices on release layers (2016-05-31),

10. 9343363 - Through-silicon vias and interposers formed by metal-catalyzed wet etching (2016-05-17),

11. 9307652 - Methods for surface attachment of flipped active components (2016-04-05),

12. 9165989 - High-yield fabrication of large-format substrates with distributed, independent control elements (2015-10-20),

13. 9161448 - Laser assisted transfer welding process (2015-10-13),

14. 9142468 - Structures and methods for testing printable integrated circuits (2015-09-22),

15. 9117940 - Optical systems fabricated by printing-based assembly (2015-08-25),

Company Overview

Semprius, Inc. is a technology company based in Durham, North Carolina, specializing in advanced solar energy solutions. The company focuses on the development and manufacturing of high-efficiency solar modules that utilize innovative designs and materials to enhance energy capture and conversion. Semprius aims to drive the adoption of solar technology through its cutting-edge research in photovoltaic systems, contributing to sustainable energy initiatives and addressing global energy challenges.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

26 Patents

#38 in Durham, NC

#297 in North Carolina

#12,865 in US

#24,826 in the World

Durham, NC, United States of America

Semprius, Inc.

Forward Citations = 2,868

25 inventors:

Etienne Menard (19 out of 66 patents)

Christopher Andrew Bower (15 out of 230 patents)

Matthew Alexander Meitl (12 out of 224 patents)

4. Joseph Carr (5 out of 18 patents)

5. John A Rogers (5 out of 143 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Semprius, Inc.. Retrieved from https://idiyas.com/company/semprius

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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