The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2016
Filed:
Nov. 14, 2014
Semprius, Inc., Durham, NC (US);
Christopher Bower, Raleigh, NC (US);
Semprius, Inc., Durham, NC (US);
Abstract
A method for selectively transferring active components from a source substrate to a destination substrate includes providing a source substrate having a process side including active components and a back side opposite the process side, the active components having respective primary surfaces including electrical connections thereon adjacent the process side and respective secondary surfaces opposite the primary surfaces and facing the back side; pressing a first stamp having first pillars protruding therefrom against the active components on the process side of the source substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to respective transfer surfaces of the first pillars; pressing a second stamp having second pillars protruding therefrom against the active components on the first pillars of the first stamp to adhere the respective secondary surfaces of the active components to respective transfer surfaces of the second pillars, wherein the respective transfer surfaces of the second pillars have greater adhesive strength than those of the first pillars; and pressing the second stamp including the active components on the second pillars thereof against a destination substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to a receiving surface of the destination substrate.