The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2016

Filed:

Sep. 20, 2011
Applicants:

Etienne Menard, Durham, NC (US);

John A. Rogers, Champaign, IL (US);

Seok Kim, Urbana, IL (US);

Andrew Carlson, Urbana, IL (US);

Inventors:

Etienne Menard, Durham, NC (US);

John A. Rogers, Champaign, IL (US);

Seok Kim, Urbana, IL (US);

Andrew Carlson, Urbana, IL (US);

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 59/02 (2006.01); H01L 21/683 (2006.01); H01L 25/00 (2006.01); H01L 23/482 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/6835 (2013.01); H01L 23/4821 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/83192 (2013.01);
Abstract

In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.


Find Patent Forward Citations

Loading…