The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Jan. 18, 2012
Applicants:

Etienne Menard, Durham, NC (US);

Matthew Meitl, Durham, NC (US);

John A. Rogers, Champaign, IL (US);

Inventors:

Etienne Menard, Durham, NC (US);

Matthew Meitl, Durham, NC (US);

John A. Rogers, Champaign, IL (US);

Assignee:

Semprius, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H05K 1/18 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 27/12 (2006.01); H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 31/048 (2014.01); H05K 13/04 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); H01S 5/022 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); H01L 21/6835 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/544 (2013.01); H01L 24/08 (2013.01); H01L 24/24 (2013.01); H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 24/75 (2013.01); H01L 24/799 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 24/98 (2013.01); H01L 27/1214 (2013.01); H01L 27/1266 (2013.01); H01L 27/14618 (2013.01); H01L 31/0203 (2013.01); H01L 31/048 (2013.01); H05K 13/04 (2013.01); H05K 13/046 (2013.01); H01L 24/02 (2013.01); H01L 24/05 (2013.01); H01L 24/27 (2013.01); H01L 24/30 (2013.01); H01L 24/32 (2013.01); H01L 24/82 (2013.01); H01L 24/92 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/056 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/08238 (2013.01); H01L 2224/245 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24147 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/24998 (2013.01); H01L 2224/2731 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29078 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/3012 (2013.01); H01L 2224/32104 (2013.01); H01L 2224/32146 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75263 (2013.01); H01L 2224/75314 (2013.01); H01L 2224/76155 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/80224 (2013.01); H01L 2224/821 (2013.01); H01L 2224/82007 (2013.01); H01L 2224/82102 (2013.01); H01L 2224/82106 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83093 (2013.01); H01L 2224/83121 (2013.01); H01L 2224/83132 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83224 (2013.01); H01L 2224/83805 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/83859 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83868 (2013.01); H01L 2224/83871 (2013.01); H01L 2224/83874 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/9512 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12044 (2013.01); H01S 5/02236 (2013.01); H01S 5/02276 (2013.01); Y02E 10/50 (2013.01); Y10T 29/49124 (2015.01); Y10T 29/51 (2015.01);
Abstract

A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer. During pressing of the stamp on the target substrate, the at least one transferable component is exposed to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer. The stamp is then separated from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate. Related systems and methods are also discussed.


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