The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2016

Filed:

Mar. 22, 2011
Applicants:

Etienne Menard, Limoges, FR;

Joseph Carr, Chapel Hill, NC (US);

Inventors:

Etienne Menard, Limoges, FR;

Joseph Carr, Chapel Hill, NC (US);

Assignee:

Semprius, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/34 (2006.01); B29C 63/00 (2006.01); H01L 21/58 (2006.01); H01L 23/00 (2006.01); H01L 21/02 (2006.01); H01L 23/31 (2006.01); H01L 21/683 (2006.01); H01L 25/03 (2006.01);
U.S. Cl.
CPC ...
H01L 21/58 (2013.01); H01L 21/02304 (2013.01); H01L 21/6835 (2013.01); H01L 23/3142 (2013.01); H01L 24/26 (2013.01); H01L 24/80 (2013.01); H01L 25/03 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68368 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12044 (2013.01);
Abstract

A method for selectively transferring active components () from a source substrate () to a destination substrate () includes providing a source substrate with one or more active components located on the source substrate, providing a destination substrate, locating a selectively curable adhesive layer () between and adjacent to the destination substrate and the source substrate, selecting one or more active components (A), selectively curing area(s) (A) of the adhesive layer corresponding to the selected active components to adhere the selected active components to the destination substrate, and removing the source substrate from the destination substrate leaving the selected active components adhered to the destination substrate in the selected areas.


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